Automatic soldering apparatus

Details Automatic soldering apparatus Automatic soldering apparatus

1993-07-20

1994-10-18

Bradley, P. Austin

Metal fusion bonding

With control means responsive to sensed condition

228 42, B23K 1008, B23K 3700

Patent

active

053560663

ABSTRACT:
An automatic soldering apparatus for soldering a printed circuit board having a plurality of electronic parts mounted thereon to be soldered while it is transported through a heating chamber having an inert gas fill therein is provided. The apparatus has a first station provided with a first opening for receiving the printed circuit board into the heating chamber and a second station provided with a second opening for removing the soldered printed circuit board from the heating chamber. Further, the apparatus has a supply of an inert gas and nozzles provided in the first and second stations. The inert gas is jetted through the nozzles toward the first and second openings, when required, so as to prevent outside air from flowing into the heating chamber.

REFERENCES:
patent: 4696226 (1987-09-01), Witmer
patent: 5090651 (1992-02-01), Mittag
patent: 5125556 (1992-06-01), Deambrosio
patent: 5203489 (1993-04-01), Gileta et al.

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