Automatic soldering

Details Automatic soldering Automatic soldering

1995-04-11

1996-10-01

Ramsey, Kenneth J.

Metal fusion bonding

Process

With condition responsive, program, or timing control

118682, 118683, 228 8, 228 37, 427 96, H05K 334

Patent

active

055605370

ABSTRACT:
The automatic soldering of printed circuit boards wherein different boards can be simultaneously processed at different stations, e.g. a fluxing station, a preheating station and a soldering station. An identification station in advance of the fluxing station controls various parameters at the processing stations in response to board type as the boards are indexed through the various stations. Parameters such as location of application, time of application, pump speed etc. may be controlled in response to board type.

REFERENCES:
patent: 4363434 (1982-12-01), Flury
patent: 4569473 (1986-02-01), Guillano
patent: 4832250 (1989-05-01), Spigarelli et al.
patent: 5148961 (1992-09-01), Humbert et al.
patent: 5176312 (1993-01-01), Lowenthal
Airvac Engineering, Co., Inc, PCBRM12 Printed Circuit Board Reflow Systems, For Desoldering and Selectively Soldering Thru-Hole Multi-Leaded Components.
Wenesco, Inc., Wenesco Brochure.
Balog et al., "Surface-Mount Component Soldering", U.S. Ser. No. 08/225,263, filed Apr. 8, 1994, Assigned to VLT, Corp.
Pullen et al., "Packaging Electrical Components", U.S. Ser. No. 08/337,245, filed Nov. 10, 1994, Assigned to VLT, Corp.

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