Automatic solder paste application to circuit boards

Details Automatic solder paste application to circuit boards Automatic solder paste application to circuit boards

1984-12-13

1987-11-03

McIntosh, John P.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

118211, 118225, 118243, B05D 128, B05C 102

Patent

active

047043059

ABSTRACT:
Solder paste is automatically applied to circuit boards, in predetermined amounts at predetermined positions by providing a plurality of holes in a nylon, "Delrin," "Teflon" or other plastic-metal plate, the holes being in a predetermined pattern, filling solder paste into the holes which are facing in an upward direction pivoting the plate over the circuit board, and ejecting the solder paste onto a circuit board. Conveniently the solder paste is ejected by pins mounted on a further plate and reciprocated in the holes. The position of the pins in the holes during filling determines the amount of solder paste filled into the holes.

REFERENCES:
patent: 2724364 (1955-11-01), Bivans et al.
patent: 3198169 (1965-08-01), Pike et al.
patent: 3604391 (1977-09-01), Mallia et al.
patent: 3952697 (1976-04-01), Bonkoske
patent: 4273607 (1981-06-01), Paul
patent: 4323593 (1982-04-01), Tsunashima
patent: 4352712 (1982-10-01), Paul

Affiliated with

Also associated with

Rating

Automatic solder paste application to circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Automatic solder paste application to circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Automatic solder paste application to circuit boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1673822