Automatic semiconductor package inspection method

Details Automatic semiconductor package inspection method Automatic semiconductor package inspection method

1990-06-04

1992-05-19

Boudreau, Leo H.

Image analysis

Histogram processing

For setting a threshold

382 55, 358101, 358106, G06K 900

Patent

active

051154757

ABSTRACT:
A visual lead-finger inspection method is provided comprising obtaining an image of a semiconductor package and enhancing an image of lead-fingers which are a part of the package. In a first embodiment the image enhancement comprises morphological opening, and in an alternate embodiment comprises direction edge enhancement. A logical AND operation is performed with the enhanced lead-finger image and a frame image which is placed through the lead-finger image, resulting in a data set of only a few hundred bytes which describes position, alignment and lead count of all of the lead-fingers on the package. The data set is compared to a stored data set to determine acceptability of the semiconductor package.

REFERENCES:
patent: 3814845 (1974-06-01), Hurlbrink, III et al.
patent: 4509075 (1985-04-01), Simms et al.
patent: 4688939 (1987-08-01), Ray
patent: 4696047 (1987-09-01), Christian et al.
patent: 4851902 (1989-07-01), Tezuka et al.
patent: 4969199 (1990-11-01), Nara
patent: 4975971 (1990-12-01), Ohnishi
Maragos, "Tutorial on Advances in Morphological Image Processing and Analysis", Optical Engineering, vol. 26, No. 7, Jul. 1987, pp. 623-632.

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