Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent
1994-08-15
1996-11-12
Ramsey, Kenneth J.
Metal fusion bonding
Process
With protecting of work or filler or applying flux
228 42, 219 8517, 432152, 432242, B23K 1012, H05K 334
Patent
active
055731740
ABSTRACT:
A reflow soldering system includes a reflow station with one or more soldering containers. Each container includes a base and a cover reciprocable to either open or close the container. When open, the container receives a printed circuit board/electrical circuit component assembly for reflow soldering, or permits the exit of such assembly after soldering. When closed, the container provides a fluid-tight seal between the chamber inside and the immediate outside environment. Container opening and closure are synchronized with an input conveyor providing assemblies to the container and an output conveyor removing the soldered assemblies, both of which are operated by a control system at a controlled rate of speed. When the container is closed, its internal environment is precisely controlled through heating elements in the container and several conduits for supplying air (heated if desired), for supplying an inert gas, and for drawing a vacuum. Further embodiment soldering systems employ pluralities of the containers and guides for selectively diverting different assemblies to different containers for enhanced flexibility and throughput.
REFERENCES:
patent: 3982887 (1976-09-01), Kendziora et al.
patent: 4586898 (1986-05-01), Orbeck
patent: 5031818 (1991-07-01), Gieskes
patent: 5195674 (1993-03-01), Nishi
Brochure entitled "Manncrop Report", Special Nepcon West Edition, 1994 Spring Edition.
Hot SMT News, Quad ZCR Ovens by Quad Systems; Horsham, Pennsylvania; date unknown.
Micri-Flo XG, Forced Convention SMT Reflow System by Research Inc., Minneapolis, Minnesota; 1992.
Brochure entitled "HVC Series Forced Convection Reflow Soldering System", by Conceptronic, Portsmouth, New Hampshire; 1993.
Brochure entitled "UNITHERM Forced Convection Reflow Soldering Systems" by Vitronics Corporation, Newmarket, New Hampshire date unknown.
Niebuhr, Esq. Frederick W.
Ramsey Kenneth J.
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