Automatic reflow soldering system

Metal fusion bonding – Process – With protecting of work or filler or applying flux

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228 42, 219 8517, 432152, 432242, B23K 1012, H05K 334

Patent

active

055731740

ABSTRACT:
A reflow soldering system includes a reflow station with one or more soldering containers. Each container includes a base and a cover reciprocable to either open or close the container. When open, the container receives a printed circuit board/electrical circuit component assembly for reflow soldering, or permits the exit of such assembly after soldering. When closed, the container provides a fluid-tight seal between the chamber inside and the immediate outside environment. Container opening and closure are synchronized with an input conveyor providing assemblies to the container and an output conveyor removing the soldered assemblies, both of which are operated by a control system at a controlled rate of speed. When the container is closed, its internal environment is precisely controlled through heating elements in the container and several conduits for supplying air (heated if desired), for supplying an inert gas, and for drawing a vacuum. Further embodiment soldering systems employ pluralities of the containers and guides for selectively diverting different assemblies to different containers for enhanced flexibility and throughput.

REFERENCES:
patent: 3982887 (1976-09-01), Kendziora et al.
patent: 4586898 (1986-05-01), Orbeck
patent: 5031818 (1991-07-01), Gieskes
patent: 5195674 (1993-03-01), Nishi
Brochure entitled "Manncrop Report", Special Nepcon West Edition, 1994 Spring Edition.
Hot SMT News, Quad ZCR Ovens by Quad Systems; Horsham, Pennsylvania; date unknown.
Micri-Flo XG, Forced Convention SMT Reflow System by Research Inc., Minneapolis, Minnesota; 1992.
Brochure entitled "HVC Series Forced Convection Reflow Soldering System", by Conceptronic, Portsmouth, New Hampshire; 1993.
Brochure entitled "UNITHERM Forced Convection Reflow Soldering Systems" by Vitronics Corporation, Newmarket, New Hampshire date unknown.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Automatic reflow soldering system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Automatic reflow soldering system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Automatic reflow soldering system will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-556971

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.