Automatic reflow apparatus with pressure equalization means

Details Automatic reflow apparatus with pressure equalization means Automatic reflow apparatus with pressure equalization means

1993-02-24

1994-03-22

Reynolds, Bruce A.

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

H05K 1304, B23K 304

Patent

active

052966801

ABSTRACT:
An automatic soldering apparatus for soldering a printed circuit board includes a plurality of electronic elements mounted thereon to be soldered thereto. The apparatus is structured to have a first station provided with a first outer opening for enabling the printed circuit board to be transported therethrough into a heating chamber so as to be soldered therein and further provided with a first inner opening, a second station provided with a second outer opening for enabling the soldered printed circuit board to be transported therethrough out of the heating chamber, and further provided with a second inner opening, and a duct having one end opening and an opposite end opening, the one end opening being connected to the first inner opening of the first station and the opposite end opening being connected to the second inner opening of the second station, the areas of the first inner opening the one end opening being larger than the area of the first outer opening, and the areas of the second inner opening and the opposite end opening being larger than the area of the second outer opening.

REFERENCES:
patent: 3882596 (1975-05-01), Kendziora et al.
patent: 4832249 (1989-05-01), Ehler
patent: 5154338 (1992-10-01), Okuno et al.

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