Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1989-11-02
1990-07-31
Heinrich, Sam
Metal fusion bonding
Process
With condition responsive, program, or timing control
228245, 228 8, 228 14, 29417, 83 761, 83 50, 83409, B23K 306
Patent
active
049444468
ABSTRACT:
A method and apparatus for feeding preform wire into a preform dispenser, cutting a piece of preform, transferring the preform to a location over an integrated circuit ceramic package, and placing the preform in the package prior to placing and attaching a die in the ceramic package.
REFERENCES:
patent: 3149510 (1964-09-01), Kulicke, Jr.
patent: 3958742 (1976-05-01), Howarth et al.
patent: 4422568 (1983-12-01), Elles et al.
patent: 4832246 (1989-05-01), Ono et al.
Busack Jon P.
Fox Angus C.
Heinrich Sam
Micro)n Technology, Inc.
Protigal Stanley N.
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