Automatic plunger apparatus for use in forming encapsulated semi

Details Automatic plunger apparatus for use in forming encapsulated semi Automatic plunger apparatus for use in forming encapsulated semi

1994-04-20

1995-12-26

Nguyen, Khanh P.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Female mold type means

425136, 425145, 425151, 425544, 26427217, B29C 4502, B29C 4518

Patent

active

054782260

ABSTRACT:
An automatic plunger apparatus is disclosed for compressing molten plastic into a cavity for forming an encapsulated semiconductor device. A compressing device drives a plunger member in order to compress and direct molten plastic to flow in a forward direction into the cavity. An overload compensator is coupled to the plunger member for permitting the plunger member to withdraw in a reverse direction when the plunger member is prevented from compressing and directing the molten plastic to flow in the forward direction into the cavity. The overload compensator includes a first member retained within a second member for transferring the force from the compressing device into motion of the plunger member. When the plunger member is prevented from compressing and directing the molten plastic to flow in the forward direction into the cavity, the first member pops out of the second member in order to permit the plunger member to withdraw in a reverse direction, thereby protecting the plunger, the cavity, and the semiconductor device.

REFERENCES:
patent: 4386898 (1983-06-01), Sera
patent: 4511317 (1985-04-01), Bandsh
patent: 4632653 (1986-12-01), Plocher
patent: 4723899 (1988-02-01), Osada
patent: 4900485 (1990-02-01), Murakami
patent: 5158780 (1992-10-01), Schraven et al.

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