Automatic plating method and apparatus thereof

Details Automatic plating method and apparatus thereof Automatic plating method and apparatus thereof

1998-09-09

2000-06-06

Gorgos, Kathryn

Chemistry: electrical and wave energy

Apparatus

Electrolytic

118423, C25B 900

Patent

active

060713879

ABSTRACT:
An automatic plating method and an apparatus thereof for plating objects to be plated placed upright in a plating tank by moving them continuously in a horizontal direction individually is provided. The method comprises detecting the height of the upper end of each object, and discharging a plating liquid in said plating tank from a hole formed at a height corresponding to the detected height of the upper end of the object out of a plurality of holes formed in the side wall of said plating tank at different heights. At the time of suspension, the plating liquid is discharged up to a position below partition doors and anodes are sunk and kept in the tank having a lowered bottom below the partition doors.

REFERENCES:
patent: 5833816 (1998-11-01), Heermann et al.
patent: 5901997 (1999-05-01), Bayer
patent: 5985123 (1999-11-01), Koon

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