Automatic mass handling system for small electronic components

Metal fusion bonding – With means to handle work or product – Work portion comprises electrical component

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29743, 269 21, H01L 2168

Patent

active

053778960

ABSTRACT:
An automatic mass handling system for the bonding of electronic components in small electronic devices, includes a plurality of modules for holding a plurality of the electronic devices in a predetermined orientation, each module including a cup-shaped main body having a circumferential wall and a bottom wall which closes a bottom of the circumferential wall, a top component holding wall secured to an upper surface of the circumferential wall and having a plurality of component holding holes therein for retaining the plurality of electronic devices therein, an aligning member for aligning the electronic devices in the component holding holes in a predetermined orientation, and a vacuum hold down hole formed in the bottom wall, for holding the electronic devices in the predetermined orientation in the plurality of component holding holes when a vacuum is applied through the vacuum hold down hole; and a boat for holding a plurality of the modules in a predetermined orientation for transportation.

REFERENCES:
patent: 3299502 (1967-01-01), Wanesky
patent: 3379357 (1968-04-01), Chagnon et al.
patent: 3704504 (1972-12-01), Koegler
patent: 3949295 (1976-04-01), Moorshead

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