Automatic liquid dispensing apparatus for spinning surface of un

Coating processes – Centrifugal force utilized

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

118 52, 118320, 118321, 264311, 427425, B05D 312

Patent

active

044515073

ABSTRACT:
An automatic fluid dispensing apparatus for coating to a substantially uniform thickness a rotating surface, such as the surface of a semiconductor wafer, with a viscous liquid, such as a slurry of passivating glass. The wafer rotation rate is related to the radial movement of a dispensing arm to maintain a constant tangential velocity of the wafer at the radial location of the dispensing arm while a bead of the slurry is dispensed at a constant rate proportional to the tangential velocity to provide a spiral beaded coating of constant volume per square. By allowing the bead to heal during or following the dispense cycle, the viscous liquid spreads to a uniform thickness.

REFERENCES:
patent: 2487111 (1949-11-01), De Koning
patent: 3198657 (1965-08-01), Kimball et al.
patent: 4267212 (1981-05-01), Sakawaki
Operation and Service Manual, "Automatic Wafer Processing System," Veeco Macronetics, Jul. 1981, pp. 1-1-7.
News Release Headway Research, Inc., "A Moving Arm Dispenser For Large Spin Coaters," Nov. 1981, (Two Sheets).
Abandoned U.S. patent application, Ser. No. 164,346, Filed Jun. 30, 1980, abandoned on 8/16/82.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Automatic liquid dispensing apparatus for spinning surface of un does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Automatic liquid dispensing apparatus for spinning surface of un, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Automatic liquid dispensing apparatus for spinning surface of un will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1397340

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.