Automatic lead frame feeding device for a TO-220 semiconductor m

Details Automatic lead frame feeding device for a TO-220 semiconductor m Automatic lead frame feeding device for a TO-220 semiconductor m

1992-05-22

1994-05-24

Huppert, Michael S.

Material or article handling

Apparatus for moving intersupporting articles into, within,...

Unstacking apparatus

4147956, 221271, B65G 5906

Patent

active

053142985

ABSTRACT:
This invention relates to an automatic lead frame feeding device for a TO-220 semiconductor manufacturing apparatus, which automatically feeds lead frames to die bonding and wire bonding processes for manufacturing TO-220 semiconductor packages, and has an object to provide an automatic lead frame feeding device which can load large quantities of lead frames at a time without using a separate magazine for loading them, and then feed automatically them accurately one by one. To this end, the feeding device includes a loading section including a pair of guide members disposed in spaced opposite relation to each other to stack up lead frames therebetween, a transferring section disposed at one side of the loading section for transverse movement to drop one by one the stacked lead frames in the loading section in sequence beginning with the lowermost lead frame, and a feeding section positioned to feed the dropped lead frame in the loading section to a subsequent process.

REFERENCES:
patent: 629441 (1899-07-01), Fogg
patent: 2268873 (1942-01-01), Hopkins et al.
patent: 4457662 (1984-07-01), Ireland et al.
patent: 4555876 (1985-12-01), Ohtake
patent: 4620285 (1986-10-01), Perdue
patent: 4674238 (1987-06-01), Suzuki et al.
patent: 4735713 (1988-04-01), Ball
patent: 4776743 (1988-10-01), Kimura
patent: 5190185 (1993-03-01), Blechl

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