Automatic lapping apparatus for piezoelectric materials

Abrasive tool making process – material – or composition – With carbohydrate or reaction product thereof

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51118, 51165R, 51133, B24B 4904

Patent

active

051368170

ABSTRACT:
An automatic lapping apparatus for lapping a piezoelectric material has upper and lower lapping plates, and a carrier disposed between the plates, for holding a piezoelectric material so that it is sandwiched between the plates. The carrier is rotatable to lap the piezoelectric material parallel to the lapping surfaces of the plates while supplying a lapping slurry therebetween. The apparatus also includes a sweep oscillator for applying a sweep signal corresponding to the count of a counter, through an AGC amplifier and a resistor to an electrode supported by one of the plates, a comparing circuit for determining whether the quartz crystal wafer is present underneath the electrode based on the level of the sweep signal applied to the electrode, a memory for storing output data from the comparing circuit at an address corresponding to the count, a dip detector for detecting a dip in the signal applied to the electrode and stopping operation of the counter, a frequency detector for reading the frequency from the sweep oscillator when the dip is detected and the presence of the piezoelectric material underneath the electrode is detected, a frequency determining circuit for determining whether the read frequency is a true resonant frequency of the quartz crystal wafer, a frequency comparator for determining that lapping is completed when the true resonant frequency falls within a predetermined target frequency, and an drive unit control circuit for stopping the carrier when the lapping is completed.

REFERENCES:
patent: 4197676 (1980-04-01), Sauerland
patent: 4199902 (1980-04-01), Sauerland
patent: 4407094 (1983-10-01), Bennett et al.

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