Automatic height sensor for semiconductor bonding tool, wafer pr

Details Automatic height sensor for semiconductor bonding tool, wafer pr Automatic height sensor for semiconductor bonding tool, wafer pr

1977-05-17

1978-08-29

Smith, Al Lawrence

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 6A, 228 9, 33174PC, H01L 2168

Patent

active

041098463

ABSTRACT:
A height sensor is disclosed which permits a tool to sense the height of a semiconductor die, or the like, above a work surface such as a bonding table. A tool arm moves transverse to the work surface and is interconnected to a cam by a second arm. The second arm is disengageable from the first arm and disengages the first arm when the tool contacts the semiconductor die. Sensing means are provided to detect the separation of the two arms.

REFERENCES:
patent: 2116593 (1938-05-01), Bouvier et al.
patent: 3125906 (1964-03-01), Johnson
patent: 3245148 (1966-04-01), Whitney
patent: 3610508 (1971-10-01), Laubmeyer
patent: 3844047 (1974-10-01), Carson

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