Automatic extrusion pinning method and apparatus

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29747, 174 685, 427 97, H05K 300, B23P 1900

Patent

active

048131300

ABSTRACT:
The method and apparatus described in the disclosure utilizes the known technique of extrusion to form a plurality of very small pins, with diameters of 0.020 inch or smaller, in a substrate of electrically nonconductive material. The number of pins is 360 or more, and the electrically conductive material described in the extrusion process is copper. A pin die is formed with the same number and pattern of holes as are in a blank substrate, and it is positioned over an extrusion die with matching orifices that is fixed on an extrusion press. A head die presses the blank substrate firmly on the pin die during the extrusion operation, and when completed, the pins are sheared and the substrate is ejected as a new blank is positioned to repeat the cycle.

REFERENCES:
patent: 3302272 (1967-02-01), Braun
patent: 3354260 (1967-11-01), Brandt et al.
patent: 3484935 (1969-12-01), Burns
patent: 3601523 (1971-08-01), Arndt
patent: 3971610 (1976-07-01), Buchoff et al.
patent: 4050756 (1977-09-01), Moore

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