Image analysis – Applications – Manufacturing or product inspection
Patent
1997-07-17
1999-10-12
Au, Amelia
Image analysis
Applications
Manufacturing or product inspection
348126, 36446817, 364490, 382224, 382232, G06K 900
Patent
active
059664592
ABSTRACT:
A method of determining classification codes for defects occurring in semiconductor manufacturing processes and for storing the information used to determine the classification codes. A wafer is selected from a production lot after the lot is sent through a first manufacturing process. The selected wafer is scanned to determine if there are defects on the wafer. Images of selected defects are examined and a numerical value is assigned to each of N elemental descriptor terms describing each defect. A classification code is determined for each defect based upon the numerical values assigned to the N elemental descriptor terms. The classification code and numerical values assigned to the N elemental descriptor terms are stored in a database. The wafer is sent through each sequential process and classification codes are assigned to additional defects selected after each sequential process. The classification codes and numerical values assigned to the N elemental descriptor terms for the additional selected defects are stored in the database. The stored numerical values assigned to the N elemental descriptor terms to modify the classification code. All of the defects stored in the database are assigned new classification codes in accordance with the modified classification code. A new classification code can be generated and all of the stored defects are assigned new classification codes in accordance with the new database.
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Chen Ming Chun
Steffan Paul J.
Advanced Micro Devices , Inc.
Au Amelia
Johnson Timothy M.
Nelson H. Donald
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