Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1974-07-08
1976-05-25
Smith, Al Lawrence
Metal fusion bonding
Process
With condition responsive, program, or timing control
228180A, 228 6A, 228 7, 228 36, H01L 2158
Patent
active
039587401
ABSTRACT:
A programmable manipulation machine for picking up a succession of small components, such as semiconductor chips, and placing them precisely in predetermined positions on a work-piece, such as a substrate. The machine includes a vacuum chuck assembly which is movable by a servomotor along a relatively long horizontal axis between a chip pick-up station and a dip assembly station and which is also movable, by means of digital stepper motors, linearly in a transverse horizontal axis and a vertical axis, and rotationally about the vertical axis. Also included are a substrate-supporting work table which is also movable, by means of a digital stepper motor, in the transverse horizontal direction, and a control unit for direction and sequencing movement of the chuck assembly and work table in accordance with operator-changeable positional data stored in a memory associated with each movement axis. A dip station, including a rotating dip wheel partially immersed in a dip bath, located between the pick-up and assembly stations, is optionally employed to apply a coating of solder paste or adhesive paste to the chips.
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Dixon Automation, Inc.
Lilly Forrest J.
Ramsey K. J.
Smith Al Lawrence
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