Automatic chemical and mechanical polishing system for semicondu

Details Automatic chemical and mechanical polishing system for semicondu Automatic chemical and mechanical polishing system for semicondu

1994-11-01

1997-07-01

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

Computer controlled

451285, 451286, 451287, 451288, 451289, 451307, 451168, 451 41, 451296, 451 6, 451 63, 451388, B24B 4900, B24B 5100

Patent

active

056430442

ABSTRACT:
A system and method for chemically and mechanically polishing a semiconductor wafer having a substrate and a surface film. A wafer mounting device, which may include a vacuum chuck, holds the semiconductor wafer without requiring that the wafer have a central aperture. The mounting device and wafer are moved with an orbit-within-an-orbit motion while a tape transport mechanism applies an abrasive polishing tape to the surface film of the moving wafer to polish one surface of the wafer to a flatness of less than two microns. The system determines the thickness of the wafer surface film during the polishing process with a real time measurement device such as an ellipsometer, or by determining a work-performed factor and calculating an estimated film thickness from the work-performed factor. Finally, the system automatically controls the polishing process to stop polishing the semiconductor wafer when the wafer surface film achieves a predefined planarization.

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