Automatic bonding tape used in semiconductor device

Details Automatic bonding tape used in semiconductor device Automatic bonding tape used in semiconductor device

1989-12-13

1992-02-11

Dean, R.

Stock material or miscellaneous articles

All metal or with adjacent metals

Having aperture or cut

428622, 428672, 428674, 174 524, 361421, H05K 102

Patent

active

050875302

ABSTRACT:
A TAB tape or tape-like carrier used for an automatic bonding process when manufacturing high-frequency semiconductor devices has a plurality of electrically conductive circuit patterns on a flexible insulative film having a plurality of holes located in gaps between adjacent circuit pattterns. A ground layer is formed on a back surface of the insulative film, and electrically conductive layers or material are formed on inner peripherals walls of the holes or filled in the holes, so that the ground layer is electrically connected to the respective conductive layers or material.

REFERENCES:
patent: 3763404 (1973-10-01), Aird
patent: 3838984 (1974-10-01), Crane et al.
patent: 4621278 (1986-11-01), Miura
patent: 4774635 (1988-09-01), Greenberg et al.
patent: 4783697 (1988-11-01), Benanati et al.
patent: 4949158 (1990-08-01), Ueda

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