Automatic bonding tape used in semiconductor device

Details Automatic bonding tape used in semiconductor device Automatic bonding tape used in semiconductor device

1991-05-28

1993-02-02

Zimmerman, John

Stock material or miscellaneous articles

All metal or with adjacent metals

Having aperture or cut

428626, 257659, 257684, 257627, H01L 23495, H01L 23498

Patent

active

051837110

ABSTRACT:
A TAB tape or tape-like carrier used for an automatic bonding process when manufacturing high-frequency semiconductor devices has a plurality of electrically conductive circuit patterns on a flexible insulative film having a plurality of holes located in gaps between adjacent circuit patterns. A ground layer is formed on a back surface of the insulative film, and electrically conductive layers or material are formed on inner peripherals walls of the holes or filled in the holes, so that the ground layer is electrically connected to the respective condcutive layers or material.

REFERENCES:
patent: 3838984 (1974-10-01), Crane
patent: 3868724 (1975-02-01), Perrino
patent: 4621278 (1986-11-01), Miura
patent: 4774635 (1988-09-01), Greenberg et al.
patent: 4783697 (1988-11-01), Benenati et al.
patent: 4791473 (1988-12-01), Phy
patent: 4933741 (1990-06-01), Schroeder
patent: 4949158 (1990-08-01), Ueda

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