Automatic bonding apparatus for assembling semiconductor devices

Details Automatic bonding apparatus for assembling semiconductor devices Automatic bonding apparatus for assembling semiconductor devices

1973-07-17

1978-10-10

Husar, Francis S.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 45, H01L 2160

Patent

active

041192591

ABSTRACT:
An automatic bonding apparatus for assembling semiconductor devices, said apparatus comprising a bonding arm carrying a capillary at one end and mounted on a pedestal swingably in a vertical plane, said pedestal being mounted on a base movably in a horizontal plane, horizontal driving cam means for driving said pedestal in the horizontal plane, vertical driving cam means for effecting swinging movement of said bonding arm, and synchronizing mechanism for determining the speed ratio of said horizontal driving cam means to said vertical driving cam means.

REFERENCES:
patent: 3110425 (1963-11-01), Fuller
patent: 3342395 (1967-09-01), Diepeneen
patent: 3653268 (1972-04-01), Diepeneen
patent: 3773240 (1973-11-01), Heim
patent: 3813022 (1974-05-01), Radobenko

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