Automatic bonder for forming wire interconnections of automatica

Details Automatic bonder for forming wire interconnections of automatica Automatic bonder for forming wire interconnections of automatica

1982-02-11

1984-05-01

Ramsey, Kenneth J.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228 45, 228 7, 228 9, 228103, 228179, B23K 3102, H01L 2190

Patent

active

044456336

ABSTRACT:
An automatic wire bonder for bonding at least one wire between a first predetermined location on a workpiece and a second predetermined location on a substrate on which the workpiece is carried includes a wire feeding head, and means for moving the head, in x, y, and z directions, relative to the workpiece, x and y being at least parallel to the plane of the workpiece and z being an elevation direction above the workpiece. Means are included for determining a z direction measurement between the first and second predetermined locations. The bonder is computer controlled to automatically dispense the wire and to configure it to a predetermined configuration to include a partially circular portion and an adjacent straight portion to be bonded between the first and second predetermined locations. The shape of the partially circular portion and the length of the straight portion are automatically determined by at least the z direction measurement.

REFERENCES:
patent: 3819102 (1974-06-01), Isobe
patent: 4068371 (1978-01-01), Miller
patent: 4109846 (1978-08-01), Pennings et al.
patent: 4266710 (1981-05-01), Bilane et al.
patent: 4327860 (1982-05-01), Kirshenboin et al.

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