Automatic assembly of semiconductor devices

Details Automatic assembly of semiconductor devices Automatic assembly of semiconductor devices

1974-08-30

1976-09-07

Lake, Roy

Metal working

Method of mechanical manufacture

Assembling or joining

B01J 1700

Patent

active

039785793

ABSTRACT:
The leads of a stem are first formed or bent to accurately position them relative to a pedestal of the stem, the pedestal being that portion of the stem on which a semiconductor pellet is to be mounted. The formed leads are thereafter used as a means for accurately locating the stem at a parts assembling work station at which a pellet is disposed on the pedestal in preselected positional relation with the leads and contacts are disposed on the leads and pressed into engagement with the pellet.

REFERENCES:
patent: 3151387 (1964-10-01), Clemens et al.
patent: 3226810 (1966-01-01), Beliveau
patent: 3390450 (1968-07-01), Checki, Jr. et al.
patent: 3564568 (1971-02-01), Bunner
patent: 3689985 (1972-09-01), Nier

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