Automated wiring apparatus

Electric heating – Metal heating – Wire – rod – or bar bonding

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Details

219 85D, 219 85F, 219233, 228 45, 228 53, 29593, 226162, B23K 112, B23K 302, B23K 306, B65H 1736

Patent

active

042687390

ABSTRACT:
A wire stringing apparatus interconnects terminals of electronic components mounted upon a circuit board. A wire stringing head, which is transported on an x-y mechanism driven by a controller, wraps an insulated wire about terminals and guide pins mounted on the circuit board. The insulated wire is connected throughout the circuitry to form all of the necessary interconnections. After the wire is installed an automatic solder feeding mechanism and a heating element are transported over the circuit board to selectively solder the interconnecting wire to the appropriate component terminals. The heat generated for the soldering procedure additionally removes the insulation from the interconnecting wire at the connection terminal. A cutting tool transported over the circuit board severs the interconnecting wire at selected points to form individual conduction paths between circuit terminals. During the stringing and soldering procedures, error checking mechanisms insure that the insulation on the interconnecting wire has not been broken, that the stringing head has not missed a guide or pin, and that the soldering apparatus has produced a reliable solder connection.

REFERENCES:
patent: 2901585 (1959-08-01), Baccari et al.
patent: 2952232 (1960-09-01), Sipala
patent: 3626086 (1971-12-01), Rubey
patent: 3734386 (1973-05-01), Hazel
patent: 3797725 (1974-03-01), Mori et al.
patent: 3825999 (1974-07-01), Rubey
patent: 3868488 (1975-02-01), Kobayashi et al.
patent: 3960309 (1976-06-01), Hazel
patent: 3999610 (1976-12-01), Sage et al.
patent: 4023724 (1977-05-01), Wakita et al.
patent: 4110880 (1978-09-01), Peppler et al.
patent: 4140265 (1979-02-01), Morino
Electronic Packaging and Production, vol. 17, No. 10, Oct. 1977, pp. 39, 40, 42, 46, 48, 49; "Interconnection Via Discrete Wiring" by Linda J. Jardine and Stephen E. Grossman.
IBM Technical Disclosure Bulletin, vol. 15, No. 12, May 1973, pp. 3837, 3838; "Automated Add-On Soldering" by Englert and Boyles.

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