Automated wafer defect inspection system using backside...

Details Automated wafer defect inspection system using backside... Automated wafer defect inspection system using backside...

2002-09-30

2009-12-08

Philippe, Gims S (Department: 2621)

Television

Special applications

Flaw detector

C348S076000

Reexamination Certificate

active

07629993

ABSTRACT:
A defect inspection system for the semiconductor and microelectronics industry. More particularly, the present invention relates to an automated defect inspection system for wafers or other semiconductor or electronic substrates of any kind or type that are transparent, translucent, opaque or otherwise capable of allowing at least some light to pass through.

REFERENCES:
patent: 3963354 (1976-06-01), Feldman et al.
patent: 4148065 (1979-04-01), Nakagawa et al.
patent: 4209257 (1980-06-01), Uchiyama et al.
patent: 4527070 (1985-07-01), Matsui et al.
patent: 5095204 (1992-03-01), Novini
patent: 5539514 (1996-07-01), Shishido et al.
patent: 5737072 (1998-04-01), Emery et al.
patent: 5892579 (1999-04-01), Elyasaf et al.
patent: 6084716 (2000-07-01), Sanada et al.
patent: 6324298 (2001-11-01), O'Dell et al.
patent: 6779386 (2004-08-01), Neo et al.

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