Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2004-08-10
2010-06-01
Strege, John B (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C250S559390
Reexamination Certificate
active
07729528
ABSTRACT:
An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.
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Harless Mark
O'Dell Jeffrey
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Watkins Cory
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Rudolph Technologies, Inc.
Strege John B
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