Automated systems and methods for adapting semiconductor...

Material or article handling – Process – Of material charging or discharging of a chamber of a type...

Reexamination Certificate

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C414S805000

Reexamination Certificate

active

07824146

ABSTRACT:
Automated systems and methods for adapting semiconductor fabrication tools to process wafers of different diameters are described. In one embodiment, a method comprises providing a semiconductor fabrication tool, placing an adapter ring on a plurality of ring holders via a robotic arm, the plurality of ring holders being operable to support the adapter ring at a vertical distance from a stage heater and the stage heater being movable in a vertical direction, placing a first semiconductor wafer on the stage heater via the robotic arm, the first semiconductor wafer having a first diameter, and moving the stage heater upward to receive the adapter ring from the plurality of ring holders and to cover a portion of the stage heater during processing of the first semiconductor wafer.

REFERENCES:
patent: 5980187 (1999-11-01), Verhovsky
patent: 6331095 (2001-12-01), Hiroki
patent: 6676761 (2004-01-01), Shang et al.
patent: 6887317 (2005-05-01), Or et al.
patent: 2004/0139917 (2004-07-01), Yamaguchi et al.

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