Material or article handling – Process – Of material charging or discharging of a chamber of a type...
Reexamination Certificate
2007-09-07
2010-11-02
Rodríguez, Saúl J (Department: 3652)
Material or article handling
Process
Of material charging or discharging of a chamber of a type...
C414S805000
Reexamination Certificate
active
07824146
ABSTRACT:
Automated systems and methods for adapting semiconductor fabrication tools to process wafers of different diameters are described. In one embodiment, a method comprises providing a semiconductor fabrication tool, placing an adapter ring on a plurality of ring holders via a robotic arm, the plurality of ring holders being operable to support the adapter ring at a vertical distance from a stage heater and the stage heater being movable in a vertical direction, placing a first semiconductor wafer on the stage heater via the robotic arm, the first semiconductor wafer having a first diameter, and moving the stage heater upward to receive the adapter ring from the plurality of ring holders and to cover a portion of the stage heater during processing of the first semiconductor wafer.
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patent: 2004/0139917 (2004-07-01), Yamaguchi et al.
Lanee Khamsidi
Moore Gerry
Advanced Technology Development Facility
Fulbright & Jaworski L.L.P.
Rodríguez Saúl J
Snelting Jonathan D
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