Semiconductor device manufacturing: process – With measuring or testing – Optical characteristic sensed
Reexamination Certificate
2007-06-12
2007-06-12
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
Optical characteristic sensed
C257SE21525
Reexamination Certificate
active
10765505
ABSTRACT:
Automated defect sourcing system identifies root-causes of yield excursion due to contamination, process faults, equipment failure and/or handling in timely manner and provides accurate timely feedback to address and contain the sources of yield excursion. A signature bank stores known wafer surface manufacturing defects as defect signatures. The signature of a manufacturing defect pattern is associated with a type of equipment or process, and used to source the manufacturing defects and to provide process control for changing and/or stopping yield excursion during fabrication. A defect signature recognition engine matches wafer defects against the signature bank during wafer fabrication. Once the defect signature is detected during fabrication, handling and/or disposing the root-cause of the corresponding defect is facilitated using messages according to an event handling database. Optionally, a real-time process control for wafer fabrication is provided.
REFERENCES:
patent: 5831865 (1998-11-01), Berezin et al.
patent: 5913105 (1999-06-01), McIntyre et al.
patent: 5982920 (1999-11-01), Tobin, Jr. et al.
patent: 6393602 (2002-05-01), Atchison et al.
patent: 6407808 (2002-06-01), Yoda et al.
patent: 6466895 (2002-10-01), Harvey et al.
patent: 6535776 (2003-03-01), Tobin, Jr. et al.
patent: 6542830 (2003-04-01), Mizuno et al.
patent: 2002/0052053 (2002-05-01), Ono et al.
Tobin, et al., Feature Analysis and Classification of Manufacturing Signatures Based on Semiconductor Wafermaps 12 pages.
Tobin, et al., Automatic Classification of Spatial Signatures on Semiconductor Wafermaps 11 pages.
Karnowski, et al., Fuzzy Logic Connectivity in Semiconductor Defect Clustering 10 pages.
Gleason, et al., An Integrated Spatial Signature Analysis and Automatic Defect Classification System 8 pages.
Gleason, et al., Rapid Yield Learning through Optical Defect and Electrical Test Analysis 11 pages.
Tobin, et al., An Image Paradigm for Semiconductor Defect Data Reduction 12 pages.
Tobin, et al., Automated Analysis for Rapid Defect Sourcing and Yeild Learning 15 pages.
Tobin, et al., Using Historical Wafermap Data for Automated Yeild Analysis 16 pages.
Tobin, et al., Adaptation of The Fuzzy K-Nearest Neighbor Classifier for Manufacturing Automation 9 pages.
Tobin, et al., Image Retrieval in the Industrial Environment 9 pages.
Luu Victor V.
Poreda John
Fernandez & Associates LLP
Lebentritt Michael
Si Glaz
Stevenson Andre′
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