Automated soldering process and apparatus

Details Automated soldering process and apparatus Automated soldering process and apparatus

1984-10-19

1985-12-24

Lin, Kuang Y.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228 561, 2281801, 219 85BA, 219121LC, B23K 108

Patent

active

045601003

ABSTRACT:
An automated discreet soldering system for plated holes of a printed wiring board, having a free piston type crucible mode of graphitic material, which is propelled along a guided path by pressurized nitrogen. A laser beam is directed along a path substantially coincident with the path of travel of the crucible to heat a susceptor surface for melting the solder therein.

REFERENCES:
patent: 4390120 (1983-06-01), Broyer

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