Automated single slice powered load lock plasma reactor

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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Details

156626, H01L 21306, B44C 122, C03C 1500, C23F 102

Patent

active

046576207

ABSTRACT:
A plasma reactor for the manufacturing of semiconductor devices has powered loadlocks and a main process chamber where slices can be processed one slice at a time with pre-etch plasma treatments before the main etching processing and afterwards receive a post etch treatment. The system comprises powered loadlocks, a main chamber, vacuum pumps radio frequency power supplier, radio frequency matching networks, heat exchangers and throttle valve and pressure controllers, gas flow distribution and microprocessor controllers. The semiconductor wafers are automatically fed one at a time from storage cassettes through isolation gates with articulated mechanical arms to a powered entry loadlock for pre-etching processes. At the completion of the pre-etching processing, the semiconductor wafer is transferred to the main chamber automatically for the main etch process and then to the powered exit loadlock for post etch treatment and finally to an output cassette.

REFERENCES:
patent: 3757733 (1973-09-01), Reinberg
patent: 4313783 (1982-02-01), Davies et al.
patent: 4318767 (1982-03-01), Hijikata et al.
patent: 4341582 (1982-07-01), Kohman et al.
patent: 4422896 (1983-12-01), Class et al.
patent: 4526670 (1985-07-01), Hajj

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