Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1984-10-22
1987-04-14
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
156626, H01L 21306, B44C 122, C03C 1500, C23F 102
Patent
active
046576207
ABSTRACT:
A plasma reactor for the manufacturing of semiconductor devices has powered loadlocks and a main process chamber where slices can be processed one slice at a time with pre-etch plasma treatments before the main etching processing and afterwards receive a post etch treatment. The system comprises powered loadlocks, a main chamber, vacuum pumps radio frequency power supplier, radio frequency matching networks, heat exchangers and throttle valve and pressure controllers, gas flow distribution and microprocessor controllers. The semiconductor wafers are automatically fed one at a time from storage cassettes through isolation gates with articulated mechanical arms to a powered entry loadlock for pre-etching processes. At the completion of the pre-etching processing, the semiconductor wafer is transferred to the main chamber automatically for the main etch process and then to the powered exit loadlock for post etch treatment and finally to an output cassette.
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patent: 4318767 (1982-03-01), Hijikata et al.
patent: 4341582 (1982-07-01), Kohman et al.
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patent: 4526670 (1985-07-01), Hajj
Brown Frederick W.
Davis Cecil J.
Hildenbrand Randall C.
Hockersmith Dan T.
Kohan Stanford P.
Heiting Leo N.
Powell William A.
Sharp Melvin
Telecky Jr. Frederick J.
Texas Instruments Incorporated
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