Automated semiconductor wafer salvage during processing

Details Automated semiconductor wafer salvage during processing Automated semiconductor wafer salvage during processing

2008-04-29

2008-04-29

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

C118S663000, C700S121000

Reexamination Certificate

active

07364922

ABSTRACT:
The present invention provides a recovery processing method to restore the substrate processing apparatus to an operating state after correcting an abnormality having occurred in the substrate processing apparatus in operation and having resulted in a stop in the operation, comprising a substrate retrieval step in which substrate salvage processing is first executed for a wafer W left in a chamber in the substrate processing apparatus in correspondence to the extent to which the wafer has been processed at the time of the operation stop and the substrate having undergone the substrate salvage processing is then retrieved into the cassette storage container and an apparatus internal state restoration step in which the states inside the individual chambers of the substrate processing apparatus are restored.

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