Automated printed circuit board assembly method

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29741, 140105, 227 77, 227113, 227155, H05K 330

Patent

active

045504946

ABSTRACT:
The method of assembling lead-mounted electric components such as DIP 18 in automated fashion to a printed circuit board 14 is accomplished by building up a crimping tool (FIG. 7) comprising a base 28 with crimping anvils 12, 20, 22, 24, by selectively positioning and orienting the anvils on the base while the base is energized to provide a moderately low strength field, and the base is then energized to provide an adequately high strength magnetic field to retain the anvils properly during the subsequent steps of mounting the components to the board and crimping the leads to produce a particular type of board. After the requisite number of boards of a particular type are built, the anvils are removed to storage and the base is rebuilt to provide a different array of anvils for a different board.

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patent: 3439416 (1969-04-01), Yando
patent: 3550238 (1970-12-01), Allen et al.
patent: 3624676 (1971-11-01), Whitney
patent: 3673665 (1972-07-01), Kindell et al.
patent: 3893232 (1975-07-01), Fletcher et al.
patent: 4125136 (1978-11-01), Olcese et al.
patent: 4283847 (1981-08-01), May
patent: 4449661 (1984-05-01), Spehrley, Jr.

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