Automated multiple lead frame strip radiant die attach material

Details Automated multiple lead frame strip radiant die attach material Automated multiple lead frame strip radiant die attach material

1997-12-16

2000-05-30

Pelham, Joseph

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

1562755, 414187, 414214, 41433113, 1983461, B65G 2508, B65G 106, H01L 2152, F27B 938

Patent

active

060693428

ABSTRACT:
A method of curing a die attach material for a semiconductor device which includes providing a carrier containing a plurality of stacked leadframe strips, each leadframe strip with a die attach material thereon. One leadframe strip is ejected from the carrier, travels into a chamber and is centered therein. The leadframe strip is then heated and the die attach material is cured selective to the leadframe strip using a tungsten-halogen lamp. Simultaneously volatile products of the cure are exhausted from the chamber. The leadframe strip is then returned to its original position in the carrier, the carrier is elevated so that a different leadframe strip is in position for ejection from the carrier and is ejected.

REFERENCES:
patent: 4712963 (1987-12-01), Kondo
patent: 4979464 (1990-12-01), Kunze-Concewitz et al.
patent: 5516251 (1996-05-01), Ichikawa
patent: 5727917 (1998-03-01), Fuke et al.
patent: 5827035 (1998-10-01), Fuke et al.
patent: 5993591 (1999-11-01), Buendia et al.

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