Automated method for the manufacture of transponder devices by w

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29595, 361392, 361421, H01F 706, H05K 702

Patent

active

050502921

ABSTRACT:
An improved automated method for the manufacture of alternatively sized passive transponder devices is presented which utilizes a single leadframe design and manufacturing process, including automated coil winding and wire-to-lead termination. A specially designed leadframe is prepared, with augmented leads, and is coated with a thin layer of silver. One or more semiconductor chips are bonded to individual assembly sites on the leadframe, after which the lead-die assembly is encapsulated by transfer molding. The cap and leads are singulated, and a bobbin is attached to the leads, which extend laterally from each individual molded cap. In an automated process, a conductive wire is attached to a first of the protruding leads, fly-wound around the bobbin core, and terminated by connection to a second of the protruding leads.

REFERENCES:
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patent: 4074227 (1978-02-01), Kalmus
patent: 4142289 (1979-03-01), Koethke
patent: 4210483 (1980-07-01), Kent
patent: 4269367 (1981-05-01), Minami et al.
patent: 4721935 (1988-01-01), Gunnels et al.

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