Automated method for the analysis and control of the electroless

Coating processes – Measuring – testing – or indicating

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427345, 4274431, B05D 104

Patent

active

047741015

ABSTRACT:
An apparatus coupled to an electroless copper plating bath for analyzing controlling, on-line, the primary constituents of the bath is described. The apparatus detects and controls not only the copper concentration of the bath by optical means, but the concentrations of hydroxyl ion, formaldehyde reducing agent and cyanide ion as well.

REFERENCES:
patent: 4286965 (1981-09-01), Vanhumbeeck
patent: 4350717 (1982-09-01), Araki
patent: 4623554 (1986-11-01), Kaschak
patent: 4650691 (1987-03-01), Kinoshita

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