Metal fusion bonding – Process – Using only pressure
Patent
1992-12-31
1994-05-24
Rowan, Kurt C.
Metal fusion bonding
Process
Using only pressure
414404, 414416, 414938, 437925, H01L 2130
Patent
active
053141075
ABSTRACT:
A method for joining a number of first and second wafers (11,12) having one polished surface in preparation for direct wafer bonding is provided. The method involves placing a number of first (11) and the same number of second (12) wafers into slots (16) of a retainer (14) so that each of the polished surfaces of the number of first wafers (11) is forced to contact one of the polished surfaces of the number of second wafers (12).
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d'Aragona Frank S.
Helsel Sherry L. F.
Wells Raymond C.
Barbee Joe E.
Elpel Jeanne M.
Motorola Inc.
Rowan Kurt C.
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