Automated interconnect routing system

Boots – shoes – and leggings

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364489, 364488, G06F 1560

Patent

active

051876710

ABSTRACT:
A method of manufacturing a multiple element circuit interconnect substrate is provided which provides an optimized routing plan. The routing plan is based upon a multi-dimensional binary data structure having nodes representing each terminal interconnect requirement which is preprocessed to order the required interconnects according to density.

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