Automated hybrid circuit board assembly apparatus

Details Automated hybrid circuit board assembly apparatus Automated hybrid circuit board assembly apparatus

1977-12-08

1979-05-01

Lanham, C. W.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

29740, 228 7, 228 47, B23K 3704, H01L 2160

Patent

active

041519450

ABSTRACT:
An apparatus for placement of electronic components on a fluxed hybrid circuit substrate. In accordance with an automated program, the apparatus at a single work station places with high precision a plurality of chips of various types and physical and electrical sizes on a single substrate. Components are successively placed by a pair of hollow pick and placement spindles operating alternately and having motion in the X-Y planes. Precise location of stored chips is not required; the apparatus orients and centers each chip after selection and prior to placement.

REFERENCES:
patent: 3337941 (1967-08-01), Drop
patent: 3361891 (1968-01-01), Whitefield
patent: 3395845 (1968-08-01), Best et al.
patent: 3465408 (1969-09-01), Clark et al.
patent: 3523352 (1970-08-01), Hayunga
patent: 3611561 (1971-10-01), Dosier
patent: 3657790 (1972-04-01), Larrison
patent: 3958740 (1976-05-01), Dixon

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