Automated chip to board process

Details Automated chip to board process Automated chip to board process

1990-11-19

1992-05-19

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29827, 156902, 174 525, 2281802, 437209, H05K 334

Patent

active

051135809

ABSTRACT:
The invention encompasses plating to form leads to allow one step bonding of a chip to tape; one step bonding of leads on the tape to a special chip package wherein chip packages may be stacked and connected as well as surface mounted and formation of a very dense circuitry on one or both sides of a board by using a photo imagable dielectric to separate circuitry and allow plating thru to form integral connections and edge connectors to connect circuitry to allow use of both sides of a board.

REFERENCES:
patent: Re31114 (1982-12-01), Berg
patent: 3832769 (1974-09-01), Olyphant, Jr. et al.
patent: 4237607 (1980-12-01), Ohno
patent: 4330812 (1982-05-01), Token
patent: 4396457 (1983-08-01), Bakermans
patent: 4616412 (1986-10-01), Schraeder
patent: 4688150 (1987-08-01), Peterson
patent: 4927491 (1990-05-01), Masaki
IBM Technical Disclosure Bull vol. 24, No. 2 Jul. 1981, pp. 1214-1215 by L. V. Auletta et al.

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