Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
Reexamination Certificate
1999-04-26
2001-09-18
Font, Frank G. (Department: 2877)
Optical waveguides
With disengagable mechanical connector
Optical fiber to a nonfiber optical device connector
C385S089000, C385S090000, C385S091000, C385S049000, C385S052000
Reexamination Certificate
active
06290401
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates generally to an optical chip holder in a pigtailing system, and particularly to an automated optical chip holder that loads the optical chip and unloads the pigtailed optical chip in an automated mass-pigtailing system.
2. Technical Background
Optical fibers must be precisely and securely aligned with integrated optical chip waveguides during a pigtailing procedure. Otherwise, light signals propagating through the resulting device will be severely degraded by attenuation and other optical losses. In addition, processes depending on the extensive use of manpower, are undesirable. From an efficiency standpoint, it is most desirable that the entire pigtailing process for loading the optical chip, precision aligning, pigtailing, and unloading be automated and reproducible.
One approach that has been considered involves the use of vacuum chucks. Typically, the optical chip is placed on a chuck platform surface having air ducts which communicate to a plenum. Subsequently, the air in the plenum is evacuated and the resulting vacuum force holds the optical chip against the platform surface. However, this approach has several drawbacks. First, vacuum chucks tend to produce air fluctuations that induce small vibrations, perturbing the optical chip. Thus, the stability of the optical chip is not maintained during the curing of the glue. More importantly, retraction stresses during the curing of the glue cause the optical chip's waveguides to be misaligned with the fiber or fiber array block. As a result, the device has a lower reliability and the resulting optical losses are high. Another drawback associated with this method is the dependency on skilled labor. An operator is required to load the optical chip and unload the pigtailed optical chip manually. Since this is a very delicate operation, the success of the pigtailing process is largely dependent on the experience of the operator.
In another approach that has been considered, a slide mechanism is used to hold the optical chip in place. The face of the optical chip substrate is used as a support reference. The slide mechanism slides against the substrate face to clamp it against a support. Although the stability of the optical device is improved, the resulting chip thickness dispersion tends to negatively affect the reproducibility of the process. Like the method described above, this method requires that an operator load the optical chip and unload the pigtailed optical chip manually. Again, since this is a very delicate operation and the success of the pigtailing process is dependent on the experience of the operator.
Thus, a need exists for an automated chip holder that precisely, securely, and repeatedly positions and aligns optical chips within the pigtailing system. Further, a need exists for an automated chip holder that automatically loads the optical chip and unload the pigtailed optical chip with minimal operator involvement; one that is suitable for mass-producing pigtailed optical devices.
SUMMARY OF THE INVENTION
The present invention addresses the problems of the conventional systems discussed above. The automated chip holder of the present invention automatically loads and precisely positions the optical chip at a predetermined position. The chip is clamped in position for pigtailing using soft resilient materials that secure the chip in two dimensions. The resilient clamp materials compensate for irregularities in the hard surfaces of the chuck platform causing the pressure that is exerted on the chip to be more uniformly distributed. Thus, micro-vibrations are substantially reduced and damage to the chip is avoided, resulting in improved manufacturing yields. In addition, the resiliency of the clamp materials will compensate for relatively coarse positional adjustments of the chuck assembly during positioning and alignment. After pigtailing, the pigtailed chip is automatically unloaded with minimal operator involvement. The chip holder accomodates optical chips having various shapes and sizes.
One aspect of the present invention is an automated chip holder for positioning an optical chip in a pigtailing system. The optical chip has a registration edge and a registration surface. The automated chip holder positions the optical chip in a three dimensional space characterized by a rectangular coordinate system having an x-axis, y-axis, and z-axis. The automated chip holder includes: a support base having a slide track disposed parallel to the x-axis; a registration member fixed to the support base for defining an alignment position in the three dimensional space; an adjustable chuck assembly slidably disposed on the slide track for moving the optical device between a device interchange position and the alignment position, the adjustable chuck assembly being movable in the x-axis direction and adjustable in the z-axis direction in response to a force directed in the x-axis direction; and a drive unit connected to the adjustable chuck assembly for applying the x-axis force to said adjustable chuck assembly.
In another aspect, the present invention includes a method for positioning an optical device in a pigtailing system using an automated chip holder. The optical device includes a registration edge and a registration surface. The automated chip holder includes a support base having a slide track, a registration member fixed to the support base for defining an alignment position in a three dimensional space characterized by a rectangular coordinate system having an x-axis, y-axis, and z-axis. The method for positioning comprising the steps of: providing an adjustable chuck assembly slidably disposed on the slide track for moving the optical device between a device interchange position and the alignment position, the adjustable chuck assembly being movable in the x-axis direction and adjustable in the z-axis direction in response to an x-axis force; and applying the x-axis force to thereby move the optical device from a device interchange position to the alignment position.
Additional features and advantages of the invention will be set forth in the detailed description which follows, and in part will be readily apparent to those skilled in the art from that description or recognized by practicing the invention as described herein, including the detailed description which follows, the claims, as well as the appended drawings.
It is to be understood that both the foregoing general description and the following detailed description are merely exemplary of the invention, and are intended to provide an overview or framework for understanding the nature and character of the invention as it is claimed. The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate various embodiments of the invention, and together with the description serve to explain the principles and operation of the invention.
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Corning Incorporated
Font Frank G.
Malley Daniel P.
Punnoose Roy M.
Smith Eric M.
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