Automated characterization system for laser chip on a submount

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S758010, C324S762010

Reexamination Certificate

active

07449905

ABSTRACT:
A temperature-controlled system for testing a laser die mounted on a submount is disclosed. The testing system comprises a base having a motor-driven translation platform. The translation platform includes a first testing site having a two-stage temperature control system mounted on a base portion. The temperature control system includes a thermoelectric cooler and a fluid system for circulating a cooling/heating fluid in a circulation block. A mounting portion is also included on the first testing site on which the submount is positioned. The temperature of the mounting portion is controlled by the temperature control system. A probe card having an arm and an electrical contact portion attached to the arm provides a power supply to the submount when the first testing site is aligned with the probe card. An aligner having a lens assembly that is alignable with the first testing site receives an optical signal produced by the laser.

REFERENCES:
patent: 6744268 (2004-06-01), Hollman
patent: 2004/0046578 (2004-03-01), Uher et al.
patent: 2005/0123445 (2005-06-01), Blecka et al.
patent: 2005/0167587 (2005-08-01), Guevrmont et al.
patent: 2005/0213882 (2005-09-01), Go et al.

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