Automated ball mounting process and system with solder ball...

Details Automated ball mounting process and system with solder ball... Automated ball mounting process and system with solder ball...

2008-07-01

2008-07-01

Stoner, Kiley (Department: 1793)

Metal fusion bonding

With control means responsive to sensed condition

C228S041000, C228S103000, C228S246000

Reexamination Certificate

active

10990123

ABSTRACT:
An automated ball mounting system is disclosed In which solder balls are tested by heating the solder balls to a temperature between the eutectic temperature of lead-tin and the melting temperature of a lead free solder ball. If the heated solder balls melt they are standard solder balls. If they do not melt they are lead free solder balls. Solder balls that are input into the automated ball mounting process are automatically tested to determine solder ball type. When the test indicates that the wrong type of solder ball is being used an error message is indicated and the solder ball mounting process stops.

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