Automated alternating polarity pulse electrolytic processing of

Details Automated alternating polarity pulse electrolytic processing of Automated alternating polarity pulse electrolytic processing of

1984-10-22

1987-05-19

Niebling, John F.

Chemistry: electrical and wave energy

Processes and products

204 23, 204 29, 204228, 204DIG9, C25D 518

Patent

active

046665676

ABSTRACT:
A method and apparatus for electroplating the surface of a conductive substrate using an electroplating solution having a low concentration of plating ions. Forward and reverse polarity current pulses are alternatively provided between the part to be plated and an anode in an electroplating bath. The process voltage, V.sub.p, between the part to be plated and the anode is sensed and the time ratio between the forward and reverse current pulses is varied to maintain the process voltage V.sub.p below a burn voltage V.sub.b.

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F. A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978, pp. 416-417.
William F. Hall et al, "Pulse Reverse Copper Plating for Printed Circuit Boards", Feb., 1983.
Dynatronix Inc., advertisement, "Dyna-Pulse Periodic Reverse Series", Feb., 1982.
Dynatronix Inc., advertisement, "DP20 Series Pulse Plating Power Supply", Jun., 1980.

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