Autocatalytic electroless gold plating composition

Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...

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106 125, 427304, C09D 100

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active

049850768

ABSTRACT:
An aqueous autocatalytic electroless gold plating composition having improved stability, a high plating rate, and excellent throwing power is provided which comprises about 0.002 to about 0.05 moles per liter (M) of a water-soluble alkali metal monovalent gold cyanide complex, about 0.01 to about 0.1M of a water-soluble cyanide compound, about 0.1 to about 1.0M of a carbonate compound, about 0.1 to about 0.45M of an aliphatic amine, and about 0.01 to about 0.1M of a reducing agent selected from the group consisting of water soluble alkali metal borohydrides and water soluble amine boranes, the plating composition to having a pH in the range of about 10-14.

REFERENCES:
patent: 4792469 (1988-12-01), Saito et al.
Matsuoka et al., Heavy Deposition of Electroless Gold, Plating and Surface Finishing, May 1988, pp. 102-106.
Ganu and Mahapatra, Electroless Gold Deposition for Electronic Industry, Journal of Scientific & Industrial Research, vol. 46, 4-1987, pp. 154-161.
Ali & Christie, A Review of Electroless Gold Deposition Processes, Gold Bull., 1984, 17(4), pp. 118-127.
Okinaka et al., Some Practical Aspects of Electroless Gold Plating, Journal of Electrochemi. Soc., 1-1974, pp. 56-62.
Pourbaix, M., Atlas of Electrochemical Equilibria in Aqueous Solutions, First English Ed., 1966, Pergamon Press, Section 5.2, pp. 168-176.
Hawley, G., The Condensed Chemical Dictionary, 8th Edition, 1971, Van Norstrand Company, pp. 229, 476, 477, 732, 738.
Lange's Handbook of Chemistry, 9th Edition, 1956, Handbook Publishers, Inc., pp. 250-251.

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