Auto-selective metal deposition on dielectric surfaces

Details Auto-selective metal deposition on dielectric surfaces Auto-selective metal deposition on dielectric surfaces

1986-07-07

1989-04-18

Newsome, John H.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 531, 427 57, 427306, B05D 306

Patent

active

048226335

ABSTRACT:
A method of plating a pattern of metal (e.g. copper or nickel) on a dielectric surface, i.e. surface of a dielectric material such as a synthetic resin or ceramic. The method comprises the preliminary step of masklessly treating the dielectric surface to selectively activate preselected areas thereof so that the dielectric surface in contact with a priming solution becomes catalytic, and thereby receptive to electroless metal deposition, selectively at those areas. The treated dielectric surface is contacted with an electroless plating solution to allow metal therefrom to auto-reductively deposit selectively at those catalized areas, thereby forming the pattern of metal desired on the dielectric surface.

REFERENCES:
patent: 2690402 (1954-09-01), Crehan
patent: 3364087 (1968-01-01), Solomon et al.
patent: 3436468 (1969-04-01), Haberecht
patent: 3954570 (1976-05-01), Shirk et al.
patent: 4165394 (1979-08-01), Ehrbar et al.
patent: 4440801 (1984-04-01), Aviram et al.

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