Audio end point detector for chemical-mechanical polishing and m

Abrasive tool making process – material – or composition – With carbohydrate or reaction product thereof

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Details

5116576, 5116588, 511313, B24B 4100

Patent

active

052457940

ABSTRACT:
An apparatus for detecting a polishing endpoint during chemical-mechanical planarization/polishing of a wafer senses an acoustic wave generated by rubbing contact between a polish pad and a hard surface underlying a softer material being removed. The apparatus includes a transducer for converting the acoustic wave energy in the range of 30 to 100 Hertz into an audio signal. The audio signal is processed by a low pass cutoff filter to remove high frequency noise. The filtered audio signal is supplied to a phase lock loop to detect a predetermined audio frequency and, in response, provide a logic signal to an integrator. The integrator integrates the logic signal over time to eliminate transient noise spikes, and supplies a detection signal only upon receiving the logic signal for a predetermined period. The detection signal starts a counter to provide a predetermined overpolishing time prior to termination of polishing operations.

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