Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1990-06-11
1994-01-18
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
29830, 156252, 174255, 174256, 174257, 174258, 361777, 361778, 428901, H05K 336, H05K 111, B32B 3100
Patent
active
052804143
ABSTRACT:
A method is disclosed of simultaneously laminating circuitized dielectric layers to form a multilayer high performance circuit board and making interlevel electrical connections. The method selects two elements which will form a eutectic at one low temperature and will solidify to form an alloy which will only remelt at a second temperature higher than any required by any subsequent lamination. The joint is made using a transient liquid bonding technique and sufficient Au and Sn to result in a Au-Sn20wt% eutectic at the low temperature. Once solidified, the alloy formed remains solid throughout subsequent laminations. As a result, a composite, multilayer, high performance circuit board is produced, electrically joined at selected lands by the solid alloy.
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Davis Charles R.
Hsiao Richard
Loomis James R.
Park Jae M.
Reid Jonathan D.
International Business Machines Corp.
Olsen Judith D.
Picard Leo P.
Sparks Donald A.
Tiegerman Bernard
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