Metal fusion bonding – Process – Diffusion type
Patent
1993-10-12
1995-06-06
Bradley, P. Austin
Metal fusion bonding
Process
Diffusion type
228195, 228198, B23K 100
Patent
active
054215072
ABSTRACT:
A method is disclosed of simultaneously laminating circuitized dielectric layers to form a multilayer high performance circuit board and making interlevel electrical connections. The method selects two elements which will form a eutectic at one low temperature and will solidify to form an alloy which will only remelt at a second temperature higher than any required by any subsequent lamination. The joint is made using a transient liquid bonding technique and sufficient Au and Sn to result in a Au--Sn20wt% eutectic at the low temperature. Once solidified, the alloy formed remains solid throughout subsequent laminations. As a result, a composite, mulilayer, high performance circuit board is produced, electrically joined at selected lands by the solid alloy.
REFERENCES:
patent: 3648357 (1972-03-01), Green, Jr.
patent: 3993238 (1976-11-01), Brook et al.
patent: 5038996 (1991-08-01), Wilcox et al.
Miller et al., IBM Tech. Discl. Bulletin, vol. 24, No. 12, May 1992, pp. 6430-6431.
L. Berstein, Journal of The Electrochemical Society, , vol. 113, No. 12, Dec. 1966, pp. 1282-1288.
Davis Charles R.
Hsiao Richard
Loomis James R.
Park Jae M.
Reid Jonathan D.
Bradley P. Austin
International Business Machines - Corporation
Knapp Jeffrey T.
Tiegerman Bernard
LandOfFree
Au-Sn transient liquid bonding in high performance laminates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Au-Sn transient liquid bonding in high performance laminates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Au-Sn transient liquid bonding in high performance laminates will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-981551