Attachment structure for solid-state imaging device

Details Attachment structure for solid-state imaging device Attachment structure for solid-state imaging device

2007-04-03

2007-04-03

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S433000, C257S435000, C257S436000, C359S640000, C359S638000, C329S350000

Reexamination Certificate

active

10184973

ABSTRACT:
An attachment structure is used for attaching a solid-state imaging device to a light exit end face of a color-separating prism. When bonding the light exit end face on the color-separating prism side and the light entrance face on the solid-state imaging device side to each other, an adhesive is applied to a predetermined position between these faces outside a region through which a luminous flux incident on the imaging section of the solid-state imaging device passes.

REFERENCES:
patent: 4268119 (1981-05-01), Hartmann
patent: 4814895 (1989-03-01), Harada et al.
patent: 5042913 (1991-08-01), Yamamoto
patent: 6614478 (2003-09-01), Mead
patent: HEI 3-14872 (1991-04-01), None

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