Semiconductor device manufacturing: process – Having organic semiconductive component
Reexamination Certificate
2005-09-13
2005-09-13
Wilson, Christian (Department: 2891)
Semiconductor device manufacturing: process
Having organic semiconductive component
C438S502000, C257S040000
Reexamination Certificate
active
06943054
ABSTRACT:
This invention provides a new procedure for attaching molecules to semiconductor surfaces, in particular silicon. The molecules, which include, but are not limited to porphyrins and ferrocenes, have been previously shown to be attractive candidates for molecular-based information storage. The new attachment procedure is simple, can be completed in short times, requires minimal amounts of material, is compatible with diverse molecular functional groups, and in some instances affords unprecedented attachment motifs. These features greatly enhance the integration of the molecular materials into the processing steps that are needed to create hybrid molecular/semiconductor information storage devices.
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Bocian David F.
Lindsey Jonathan S.
Liu Zhiming
Loewe Robert S.
Yasseri Amir A.
Hunter Tom
Quine Intellectual Property Law Group, PC
The Regents of the University of California
Wilson Christian
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